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PREVIEW
... did not have a clear goal.
Gu Song directly started to search for relevant information on Through Silicon Through Silicon Technology (TSV).
TSV technology was actually proposed by IBM as early as 1964 and patented 3 years later.
But if this technology is to be applied to chip packaging, many problems have to be solved.
Innovation in processes that are already micron or even nanoscale, involving wafer thinning, etching, vias, wafer particle bonding, and cutti ...
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